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PER Performance Enhancement through Antenna And Transceiver Co-Design for Multi-band OFDM UWB Communication
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
2008 (English)In: 2008 INTERNATIONAL SYMPOSIUM ON SYSTEM-ON-CHIP, PROCEEDINGS / [ed] Nurmi J, Takala J, Vainio O, NEW YORK: IEEE , 2008, 142-146 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper investigates the packet error rate (PER) performance enhancement through the antenna and the transceiver co-design for MB-OFDM UWB system. Five different UWB antennas, covering the whole UWB spectrum, are selected for study. Through the link-margin analysis and PER performance simulation, radio transceiver design specifications are optimized according to different antennas' performance at different band groups. Transmitter pre-distortion and receiver equalization are applied at the front-end of the transceiver to co-design with the antenna, which further enhance PER performance. Our study reveals that, antenna is an important part of radio transceiver which has to be considered in advance during the chip design [1], particularly in the ultra-wide band radio system. Through the antenna and radio front-end co-design, not only could PER performance be enhanced, but also could design parameters be relaxed for the power amplifier (PA) and the low noise amplifier (LNA), particularly for higher band groups.

Place, publisher, year, edition, pages
NEW YORK: IEEE , 2008. 142-146 p.
Keyword [en]
PER, Antenna, Transceiver, Co-design, UWB
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-31543DOI: 10.1109/ISSOC.2008.4694875ISI: 000262647700032Scopus ID: 2-s2.0-67249110804ISBN: 978-1-4244-2541-9 (print)OAI: oai:DiVA.org:kth-31543DiVA: diva2:408297
Conference
10th Annual International Symposium on System-on-Chip Tampere, FINLAND, 2008
Note
QC 20110404Available from: 2011-04-04 Created: 2011-03-18 Last updated: 2012-02-13Bibliographically approved

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