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Semi-ellipse method for accounting for the pile-up contact area during nanoindentation with the Berkovich indenter
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.
2006 (English)In: Scripta Materialia, ISSN 1359-6462, E-ISSN 1872-8456, Vol. 55, no 8, 699-702 p.Article in journal (Refereed) Published
Abstract [en]

A method of approximating the pile-up contact perimeter as a semi-ellipse originally developed for soda-lime glass, has been investigated for its applicability to other materials including work-hardened copper, Zr-based bulk metallic glass, strontium fluoroapatite, tungsten carbide, silicon nitride and aluminium oxide. The study revealed that all the materials formed pile-ups during nanoindentation. The elastic modulus and hardness values obtained after correcting for the pile-up contact area using the semiellipse approximation were,consistent with those found in the literature.

Place, publisher, year, edition, pages
2006. Vol. 55, no 8, 699-702 p.
Keyword [en]
nanoindentation, pile-up, hardness, metals, amorphous materials
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:kth:diva-37494DOI: 10.1016/j.scriptamat.2006.06.030ISI: 000240185600010Scopus ID: 2-s2.0-33847240162OAI: oai:DiVA.org:kth-37494DiVA: diva2:434309
Note
QC 20110815Available from: 2011-08-15 Created: 2011-08-12 Last updated: 2017-12-08Bibliographically approved

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