Small footprint wafer-level vacuum packaging using compressible gold sealing rings
2011 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 21, no 8, 085011- p.Article in journal (Refereed) Published
A novel low-temperature wafer-level vacuum packaging process is presented. The process uses plastically deformed gold rings as sealing structures in combination with flux-free soldering to provide the bond force for a sealing wafer. This process enables the separation of the sealing and the bonding functions both spatially on the wafer and temporally in different process steps, which results in reduced areas for the sealing rings and prevents outgassing from the solder process in the cavity. This enables space savings and yields improvements. We show the experimental result of the hermetic sealing. The leak rate into the packages is determined, by measuring the package lid deformation over 10 months, to be lower than 3.5 x 10(-13) mbar l s(-1), which is suitable for most MEMS packages. The pressure inside the produced packages is measured to be lower than 10 mbar.
Place, publisher, year, edition, pages
2011. Vol. 21, no 8, 085011- p.
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-37545DOI: 10.1088/0960-1317/21/8/085011ISI: 000293163700011ScopusID: 2-s2.0-80051509093OAI: oai:DiVA.org:kth-37545DiVA: diva2:434700
QC 201108162011-08-162011-08-152013-03-25Bibliographically approved