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Design and implementation of a fully reconfigurable chipless RFID tag using inkjet printing technology
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
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2008 (English)In: Proceedings - IEEE International Symposium on Circuits and Systems, 2008, 1524-1527 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, a novel fully reconfigurable chipless RFID tag has been presented. 8-bit data are encoded by impedance mismatches along transmission line. Inkjet printing is used to reconfigure for special tag IDs. By integrating inkjet printing technology, printable tags are not only economically feasible but also technically efficient. The remarkable idea has been successfully validated both by simulation and experimental measurements.

Place, publisher, year, edition, pages
2008. 1524-1527 p.
Series
IEEE International Symposium on Circuits and Systems, ISSN 0277-674X ; 1-10
National Category
Electrical Engineering, Electronic Engineering, Information Engineering Computer and Information Science
Identifiers
URN: urn:nbn:se:kth:diva-38372DOI: 10.1109/ISCAS.2008.4541720ISI: 000258532101112Scopus ID: 2-s2.0-51749094833ISBN: 978-1-4244-2078-0 (print)OAI: oai:DiVA.org:kth-38372DiVA: diva2:437281
Conference
2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008; Seattle, WA; 18 May 2008 through 21 May 2008
Note

QC 20110829

Available from: 2011-08-29 Created: 2011-08-25 Last updated: 2016-12-19Bibliographically approved

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Zheng, LinlinRodriguez, SaulZhang, LuShao, BotaoZheng, Li-Rong
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VinnExcellence Center for Intelligence in Paper and Packaging, iPACKElectronic, Computer and Software Systems, ECS
Electrical Engineering, Electronic Engineering, Information EngineeringComputer and Information Science

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CiteExportLink to record
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Citation style
  • apa
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  • ieee
  • modern-language-association-8th-edition
  • vancouver
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More styles
Language
  • de-DE
  • en-GB
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  • fi-FI
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  • nn-NB
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  • Other locale
More languages
Output format
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  • asciidoc
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