Biocompatible "click" wafer bonding for microfluidic devices
2012 (English)In: Lab on a Chip, ISSN 1473-0197, E-ISSN 1473-0189, Vol. 12, no 17, 3032-3035 p.Article in journal (Refereed) Published
We introduce a novel dry wafer bonding concept designed for permanent attachment of micromolded polymer structures to surface functionalized silicon substrates. The method, designed for simultaneous fabrication of many lab-on-chip devices, utilizes a chemically reactive polymer microfluidic structure, which rapidly bonds to a functionalized substrate via "click" chemistry reactions. The microfluidic structure consists of an off-stoichiometry thiol-ene (OSTE) polymer with a very high density of surface bound thiol groups and the substrate is a silicon wafer that has been functionalized with common bio-linker molecules. We demonstrate here void free, and low temperature (<37 degrees C) bonding of a batch of OSTE microfluidic layers to a silane functionalized silicon wafer.
Place, publisher, year, edition, pages
RSC Publishing, 2012. Vol. 12, no 17, 3032-3035 p.
Adhesive, wafer bonding, heterogeneous integration, OSTE
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-38608DOI: 10.1039/c2lc21098cISI: 000307066400008ScopusID: 2-s2.0-84864674588OAI: oai:DiVA.org:kth-38608DiVA: diva2:437754
FunderEU, European Research Council
QC 20120903. Updated from submitted to published.2011-08-302011-08-302015-06-18Bibliographically approved