Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS
2011 (English)In: IEEE Journal of Selected Topics in Quantum Electronics, ISSN 1077-260X, E-ISSN 1558-4542, Vol. 17, no 3, 629-644 p.Article in journal (Refereed) Published
Wafer-level heterogeneous integration technologies for microoptoelectromechanical systems (MOEMS), microelectromechanical systems (MEMS), and nanoelectromechanical systems (NEMS) enable the combination of dissimilar classes of materials and components into single systems. Thus, high-performance materials and subsystems can be combined in ways that would otherwise not be possible, and thereby forming complex and highly integrated micro-or nanosystems. Examples include the integration of high-performance optical, electrical or mechanical materials such as monocrystalline silicon, graphene or III-V materials with integrated electronic circuits. In this paper the state-of-the-art of wafer-level heterogeneous integration technologies suitable for MOEMS, MEMS, and NEMS devices are reviewed. Various heterogeneous MOEMS, MEMS, and NEMS devices that have been described in literature are presented.
Place, publisher, year, edition, pages
2011. Vol. 17, no 3, 629-644 p.
Microelectromechanical system (MEMS), microoptoelectromechanical system (MOEMS), More-than-Moore, nanoelectromechanical system (NEMS), photonic integration, self-assembly, wafer-level heterogeneous integration
Atom and Molecular Physics and Optics Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-39070DOI: 10.1109/JSTQE.2010.2093570ISI: 000291403100017ScopusID: 2-s2.0-79958280952OAI: oai:DiVA.org:kth-39070DiVA: diva2:439428