Early selection of system implementation choice among SoC, SoP and 3-D integration
2007 (English)In: Proceedings - 20th Anniversary IEEE International SOC Conference / [ed] Sezer, S; Chen, SJ; Marshall, A; Tran, T, 2007, 187-190 p.Conference paper (Refereed)
Recently there is a tendency for shifting the planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration, and the designers confronted with several system design options. To get a true improvement in performance, a very careful analysis using detailed models at different hierarchical levels is crucial. In this work, we present a cohesive analysis of the technological, cost and performance trade-offs for implementing digital and mixed-mode systems considering the choices between 2-D and 3-D integration and their ramifications.
Place, publisher, year, edition, pages
2007. 187-190 p.
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-40703DOI: 10.1109/SOCC.2007.4545455ISI: 000257572200043ScopusID: 2-s2.0-51049118099ISBN: 978-1-4244-1592-2OAI: oai:DiVA.org:kth-40703DiVA: diva2:442655
20th Anniversary IEEE International SOC Conference; Hsinchu; 26 September 2007 through 29 September 2007