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Early selection of system implementation choice among SoC, SoP and 3-D integration
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
2007 (English)In: Proceedings - 20th Anniversary IEEE International SOC Conference / [ed] Sezer, S; Chen, SJ; Marshall, A; Tran, T, 2007, 187-190 p.Conference paper, Published paper (Refereed)
Abstract [en]

Recently there is a tendency for shifting the planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration, and the designers confronted with several system design options. To get a true improvement in performance, a very careful analysis using detailed models at different hierarchical levels is crucial. In this work, we present a cohesive analysis of the technological, cost and performance trade-offs for implementing digital and mixed-mode systems considering the choices between 2-D and 3-D integration and their ramifications.

Place, publisher, year, edition, pages
2007. 187-190 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-40703DOI: 10.1109/SOCC.2007.4545455ISI: 000257572200043Scopus ID: 2-s2.0-51049118099ISBN: 978-1-4244-1592-2 (print)OAI: oai:DiVA.org:kth-40703DiVA: diva2:442655
Conference
20th Anniversary IEEE International SOC Conference; Hsinchu; 26 September 2007 through 29 September 2007
Available from: 2011-09-22 Created: 2011-09-20 Last updated: 2011-09-22Bibliographically approved

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CiteExportLink to record
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