System-on-flexible-substrates: Electronics for future smart-intelligent world
2006 (English)In: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, NEW YORK: IEEE , 2006, 29-36 p.Conference paper (Refereed)
In this paper, we present architecture, circuit implementation and integration issues of embedded smart systems on flexible substrates for future ubiquitous intelligent world. The work is exampled by several concepts of innovative, self-powered, Ion I g-range interconnected radio-frequency identification and sensor networks in warehouse and intelligent goods distribution systems. Two types of RFID concepts are designed for this network. The first one is a self-powered, ultra-low power UWB RFID. A power scavenging system is designed which can draws energy from the 802.11 access point and its surrounding electromagnetic waves. In the second demonstration, we developed a chipless passive RFID based on time-domain reflection principle. As this RFID is chipless and needs only interconnections and antenna, it is potentially fully printable on flexible substrate such as a paper board. Finally, some implementation and experimental results are presented.
Place, publisher, year, edition, pages
NEW YORK: IEEE , 2006. 29-36 p.
IdentifiersURN: urn:nbn:se:kth:diva-42380DOI: 10.1109/HDP.2006.1707561ISI: 000239687300045ScopusID: 2-s2.0-34250866926ISBN: 1-4244-0488-6OAI: oai:DiVA.org:kth-42380DiVA: diva2:447303
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27-28 June 2006
QC 201411132011-10-112011-10-102015-06-25Bibliographically approved