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System-on-flexible-substrates: Electronics for future smart-intelligent world
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
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2006 (English)In: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, NEW YORK: IEEE , 2006, 29-36 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, we present architecture, circuit implementation and integration issues of embedded smart systems on flexible substrates for future ubiquitous intelligent world. The work is exampled by several concepts of innovative, self-powered, Ion I g-range interconnected radio-frequency identification and sensor networks in warehouse and intelligent goods distribution systems. Two types of RFID concepts are designed for this network. The first one is a self-powered, ultra-low power UWB RFID. A power scavenging system is designed which can draws energy from the 802.11 access point and its surrounding electromagnetic waves. In the second demonstration, we developed a chipless passive RFID based on time-domain reflection principle. As this RFID is chipless and needs only interconnections and antenna, it is potentially fully printable on flexible substrate such as a paper board. Finally, some implementation and experimental results are presented.

Place, publisher, year, edition, pages
NEW YORK: IEEE , 2006. 29-36 p.
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:kth:diva-42380DOI: 10.1109/HDP.2006.1707561ISI: 000239687300045Scopus ID: 2-s2.0-34250866926ISBN: 1-4244-0488-6 (print)OAI: oai:DiVA.org:kth-42380DiVA: diva2:447303
Conference
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27-28 June 2006
Note

QC 20141113

Available from: 2011-10-11 Created: 2011-10-10 Last updated: 2015-06-25Bibliographically approved

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Zheng, Li-RongNejad, Majid B.Rodriguez, SaulZhang, LuChen, CairongTenhunen, Hannu
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CiteExportLink to record
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