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Measurements of the thermal diffusivity of some CaO-AI(2)O(3)-SiO2 containing slags using the laser flash method
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering.
2005 (English)In: Thermal Conductivity 26: Thermal Expansion 14 / [ed] Dinwiddie, RB; Mannello, R, LANCASTER: DESTECH PUBLICATIONS , 2005, Vol. 26, 26-37 p.Conference paper (Refereed)
Abstract [en]

In an attempt to systematize the knowledge on the heat conduction of liquid silicates, the thermal diffusivities of some synthetic slags containing CaO, Al2O3 and SiO2 have been measured, using the three-layer laser flash method on a differential scheme in the temperature range 1625 to 1825 K. The measured effective thermal diffusivities, which would be a combination of the phononic and photonic heat transfer mechanisms, were found to increase with increasing temperature for all the presently investigated slags. The slag compositions were chosen in such a way that the changes in the thermal diffusivities would reflect the changes in the structure of the slags. The results of the measurements clearly show that, at a CaO/Al2O3 molar ratio of 4.42, an increase of the SiO2 content had very little effect on the effective thermal diffusivity values. On the other hand, addition of SiO2 to a slag with a CaO/Al2O3 molar ratio of 2.59 resulted in a significant increase in the thermal diffasivities. Addition of Al2O3 to slags with constant CaO/SiO2 molar ratio resulted in a marked increase in the thermal diffasivities. Both these trends indicate the strong influence of the network formation in silicate melts on the beat conduction. The Arrhenius activation energies for effective thermal diffusivities were derived from the present experimental data and were found to be dependent on the composition of the slag in the experimental temperature range.

Place, publisher, year, edition, pages
National Category
Materials Engineering
URN: urn:nbn:se:kth:diva-43218ISI: 000244464900003ISBN: 978-1-932078-36-7OAI: diva2:447809
26th International Thermal Conductivity Conference/14th International Thermal Expansion Symposium. Cambridge, MA. AUG 06-08, 2001
QC 20111013Available from: 2011-10-13 Created: 2011-10-13 Last updated: 2012-03-22Bibliographically approved

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