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Chip-package codesign of receiver front end modules for RF/wireless applications
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
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2005 (English)In: 2005 IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics, New York: IEEE , 2005, 767-770 p.Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
New York: IEEE , 2005. 767-770 p.
National Category
Telecommunications
Identifiers
URN: urn:nbn:se:kth:diva-43141DOI: 10.1109/WCACEM.2005.1469698ISI: 000232402200185ISBN: 0-7803-9068-7 (print)OAI: oai:DiVA.org:kth-43141DiVA: diva2:448238
Conference
IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics. Honolulu, HI. APR 03-07, 2005
Note

QC 20111014

Available from: 2011-10-14 Created: 2011-10-13 Last updated: 2012-09-26Bibliographically approved

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Amin, YasarTenhunen, HannuZheng, Li-RongDuo, Xinzhong
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CiteExportLink to record
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Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
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More styles
Language
  • de-DE
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