High Frequency Characterization and Modelling of Inkjet Printed Interconnects On Flexible Substrate for Low-Cost RFID Applications
2008 (English)In: ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, NEW YORK: IEEE , 2008, 695-699 p.Conference paper (Refereed)
This paper presents the characterization and modeling of inkjet printed interconnects on flexible polyimide substrate using nano-paticle silver ink for low-cost RFID applications. Then TDR/TDT and S-parameter measurements are performed at high frequency from 30 kHz to 6 GHz. A Jumped equivalent circuit and distributed parameter model of the printed interconnects have been developed for the realization of the full printed RFID tags. Additionally the related electrical properties of the printed interconnects are extracted.
Place, publisher, year, edition, pages
NEW YORK: IEEE , 2008. 695-699 p.
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-38653DOI: 10.1109/ESTC.2008.4684435ISI: 000261094400126ScopusID: 2-s2.0-58149101336ISBN: 978-1-4244-2813-7OAI: oai:DiVA.org:kth-38653DiVA: diva2:450231
2nd Electronics System-Integration Technology Conference, Greenwich, ENGLAND, SEP 01-04, 2008
QC 201110202011-10-202011-08-312014-03-04Bibliographically approved