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WAFER-LEVEL MECHANICAL AND ELECTRICAL INTEGRATION OF SMA WIRES TO SILICON MEMS USING ELECTROPLATING
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
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2011 (English)In: 24th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2011), IEEE conference proceedings, 2011, 1281-1284 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper reports on the wafer-level fixation and electrical connection of pre-strained SMA wires on silicon MEMS using electroplating, providing high bond strength and electrical connections in one processing step. The integration method is based on standard micromachining techniques, and it potentially allows mass production of microactuators having high work density. SEM observation showed an intimate interconnection between the SMA wire and the silicon substrate, and destructive testing performed with a shear tester showed a bond strength exceeding 1 N. The first Joule-heated SMA wire actuators on silicon were fabricated and their performance evaluated. Measurements on a 4.5 x 1.8 mm2 footprint device show a 460 μm stroke at low power consumption (70 mW).

Place, publisher, year, edition, pages
IEEE conference proceedings, 2011. 1281-1284 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-47311DOI: 10.1109/MEMSYS.2011.5734667Scopus ID: 2-s2.0-79953789149ISBN: 978-1-4244-9632-7 (print)OAI: oai:DiVA.org:kth-47311DiVA: diva2:454731
Conference
24th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2011), Cancun,MEXICO, 23 -27 Jan, 2011
Note

QC 20111109

Available from: 2011-11-08 Created: 2011-11-08 Last updated: 2015-06-04Bibliographically approved

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Stemme, Göranvan der Wijngaart, Wouter

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