WAFER-LEVEL MECHANICAL AND ELECTRICAL INTEGRATION OF SMA WIRES TO SILICON MEMS USING ELECTROPLATING
2011 (English)In: 24th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2011), IEEE conference proceedings, 2011, 1281-1284 p.Conference paper (Refereed)
This paper reports on the wafer-level fixation and electrical connection of pre-strained SMA wires on silicon MEMS using electroplating, providing high bond strength and electrical connections in one processing step. The integration method is based on standard micromachining techniques, and it potentially allows mass production of microactuators having high work density. SEM observation showed an intimate interconnection between the SMA wire and the silicon substrate, and destructive testing performed with a shear tester showed a bond strength exceeding 1 N. The first Joule-heated SMA wire actuators on silicon were fabricated and their performance evaluated. Measurements on a 4.5 x 1.8 mm2 footprint device show a 460 μm stroke at low power consumption (70 mW).
Place, publisher, year, edition, pages
IEEE conference proceedings, 2011. 1281-1284 p.
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-47311DOI: 10.1109/MEMSYS.2011.5734667ScopusID: 2-s2.0-79953789149ISBN: 978-1-4244-9632-7OAI: oai:DiVA.org:kth-47311DiVA: diva2:454731
24th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2011), Cancun,MEXICO, 23 -27 Jan, 2011
QC 201111092011-11-082011-11-082015-06-04Bibliographically approved