Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level
2011 (English)In: Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS), IEEE , 2011, 356-359 p.Conference paper (Other academic)
This paper reports a novel room temperature hermetic liquid sealing process based on wire bonded "plugs" over the access ports of liquid-filled cavities. The method enables liquids to be integrated already at the fabrication stage. Test vehicles were manufactured and used to investigate the mechanical and hermetic properties of the seals. A helium leak rate of better than 1E-10 mbarL/s was measured on the successfully sealed structures. The bond strength of the "plugs" were similar to standard wire bonds on flat surfaces.
Place, publisher, year, edition, pages
IEEE , 2011. 356-359 p.
, Proceedings: IEEE micro electro mechanical systems, ISSN 1084-6999
Bonding, Cavity resonators, Gold, Micromechanical devices, Seals, Silicon, Wire
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-47360DOI: 10.1109/MEMSYS.2011.5734435ISI: 000295841200088ScopusID: 2-s2.0-79953780865OAI: oai:DiVA.org:kth-47360DiVA: diva2:454846
International Conference on Micro Electro Mechanical Systems (MEMS)
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QC 201111102011-11-102011-11-082011-11-15Bibliographically approved