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Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
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2011 (English)In: Proceedings IEEE International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers), IEEE , 2011, 1360-1363 p.Conference paper, Published paper (Other academic)
Abstract [en]

This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold “bumps”, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities was measured over 5 days and evaluated to less than the detection limit, 6×10-12 mbarL/s, per sealed port. The cavities have been sealed at a vacuum level below 10 mbar. The method enables sealing of vacuum cavities at room temperature using standard commercial tools and processes.

Place, publisher, year, edition, pages
IEEE , 2011. 1360-1363 p.
Keyword [en]
Bonding, Cavity resonators, Force, Gold, Silicon, Substrates, Wires
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-47359DOI: 10.1109/TRANSDUCERS.2011.5969522Scopus ID: 2-s2.0-80052111264OAI: oai:DiVA.org:kth-47359DiVA: diva2:454852
Note
Poster presentation. © 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. QC 20111110Available from: 2011-11-10 Created: 2011-11-08 Last updated: 2011-11-10Bibliographically approved

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Fischer, AndreasStemme, GöranNiklaus, Frank

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