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Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-8853-0967
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2011 (English)In: 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011 IEEE, IEEE , 2011, 348-351 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper reports on the first integration of SMA wires into silicon based MEMS structures using a standard wire bonder. This approach allows fast and efficient placement, alignment and mechanical attachment of NiTi-based SMA wires to silicon-based MEMS. The wires are mechanically anchored and clamped into deep-etched silicon structures on a wafer. The placement precision is high with an average deviation of 4 #x03BC;m and the mechanical clamping is strong, allowing successful actuation of the SMA wires.

Place, publisher, year, edition, pages
IEEE , 2011. 348-351 p.
Series
Proceedings: IEEE micro electro mechanical systems, ISSN 1084-6999
Keyword [en]
MEMS structures;NiTi;SMA wires;deep-etched silicon structures;mechanical clamping;microactuator fabrication;shape memory alloy wire;size 4 mum;standard wire bonding technology;wafer-level integration;etching;lead bonding;microactuators;nickel compounds;wafer level packaging;
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-47428DOI: 10.1109/MEMSYS.2011.5734433ISI: 000295841200086Scopus ID: 2-s2.0-79953794837OAI: oai:DiVA.org:kth-47428DiVA: diva2:455234
Conference
24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011 IEEE
Note
© 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.QC 20111110Available from: 2011-11-18 Created: 2011-11-09 Last updated: 2011-12-08Bibliographically approved

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Fischer, Andreas C.Schröder, StephanStemme, GöranNiklaus, Frank

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