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Hidden-hinge micro-mirror arrays made by heterogeneous integration of two mono-crystalline silicon layers
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
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2011 (English)In: 2011 IEEE 24th International Conference On Micro Electro Mechanical Systems (MEMS), 2011, 696-699 p.Conference paper (Refereed)
Abstract [en]

In this paper we present wafer-level heterogeneous integrated hidden-hinge micro-mirror arrays for adaptive optics applications. The micro-mirrors are made of monocrystalline silicon and fabricated by two cycles of adhesive wafer bonding on fan-out substrates with addressing electrodes. The fabrication scheme allows the down-scaling of the micro-mirrors in size, the up-scaling of the array size and the implementation of additional material layers. Furthermore, large distances of the micro-mirrors to the electrodes can be achieved and hence a large deflection of the mirrors is possible. The micro-mirrors exhibit excellent deflection stability; no drift or hysteresis can be observed.

Place, publisher, year, edition, pages
2011. 696-699 p.
, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), ISSN 1084-6999
Keyword [en]
Crystalline materials, Electrodes, Mechanical engineering, Mechanics, MEMS, Monocrystalline silicon, Reactive ion etching, Semiconducting silicon compounds, Silicon wafers, Wafer bonding Engineering main heading, Mirrors
National Category
Engineering and Technology
URN: urn:nbn:se:kth:diva-48008DOI: 10.1109/MEMSYS.2011.5734520ISI: 000295841200173ScopusID: 2-s2.0-79953771546ISBN: 978-1-4244-9634-1OAI: diva2:456604
24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Location: Cancun, MEXICO Date: JAN 23-27, 2011
QC 20111115Available from: 2011-11-15 Created: 2011-11-15 Last updated: 2011-11-25Bibliographically approved

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Lapisa, Martin A.Stemme, GöranNiklaus, Frank
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