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HETEROGENEOUS INTEGRATION TECHNOLOGY FOR COMBINATION OF DIFFERENT WAFER SIZES USING AN EXPANDABLE HANDLE SUBSTRATE
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-9820-8728
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
2011 (English)In: PROC IEEE MICR ELECT: IEEE MICRO ELECTRO MECHANICAL SYSTEMS, 2011, 268-271 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smaller substrate onto a larger wafer substrate by using a standard matrix expander in combination with adhesive wafer bonding and an elastic dice tape. We demonstrate the expansion and transfer of about 30000 chips from a 100 mm wafer to a 200 mm wafer with a 22 mu m standard deviation of positioning accuracy. Fabrication, evaluation method and results are presented.

Place, publisher, year, edition, pages
2011. 268-271 p.
Series
Proceedings: IEEE micro electro mechanical systems, ISSN 1084-6999
Keyword [en]
Mechanical engineering, Mechanics, MEMS, Reactive ion etching, Transfer matrix method
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-48004DOI: 10.1109/MEMSYS.2011.5734413ISI: 000295841200067Scopus ID: 2-s2.0-79953802096OAI: oai:DiVA.org:kth-48004DiVA: diva2:456652
Conference
24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Cancun, MEXICO, JAN 23-27, 2011
Note
QC 20111115Available from: 2011-11-15 Created: 2011-11-15 Last updated: 2011-11-15Bibliographically approved

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Forsberg, FredrikStemme, GöranNiklaus, Frank

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