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On the stability of delamination growth at scratching of thin film structures
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.), Solid Mechanics (Div.).
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.), Solid Mechanics (Div.).ORCID iD: 0000-0001-6232-8819
2011 (English)In: JCT Research, ISSN 1547-0091, E-ISSN 1935-3804, Vol. 8, no 6, 707-717 p.Article in journal (Refereed) Published
Abstract [en]

Scratching of thin film/substrate structures is studied theoretically and numerically. The results are discussed in connection to delamination initiation and in particular subsequent growth at scratching. The material behavior of the film is described by classical elastoplasticity accounting for large deformations. The deformation of the substrate is neglected indicating that the results are pertinent to soft thin films. The numerical investigation is performed using the finite element method (FEM) and the numerical strategy is discussed in some detail. The results from this study show that delamination growth at thin film scratching is a stable feature with crack arrest occurring at a decreasing load.

Place, publisher, year, edition, pages
2011. Vol. 8, no 6, 707-717 p.
Keyword [en]
Scratching, Film/substrate structures, Delamination growth, Stability, FEM analysis
National Category
Engineering and Technology
URN: urn:nbn:se:kth:diva-48511DOI: 10.1007/s11998-011-9352-zISI: 000296392400005ScopusID: 2-s2.0-80054907897OAI: diva2:458288
QC 20111121Available from: 2011-11-22 Created: 2011-11-21 Last updated: 2011-11-22Bibliographically approved

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Wredenberg, FredrikLarsson, Per Lennart
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