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Fabrication of mono-crystalline Silicon Micro-mirror Arrays using adhesive Wafer Transfer Bonding
KTH, School of Electrical Engineering (EES), Microsystem Technology.
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2009 (English)In: MikroSystemTechnik KONGRESS 2009, 2009Conference paper, Published paper (Other academic)
Abstract [en]

Spatial light modulators (SLMs) based on indivvidually addressable micro-mirrors do show an increased use in projection displays, DUV lithography and adaptive optics. Mirror planarity and deflection characteristics are important issues for these applications. Mono-crystalline silicon as mirror material offers a great possibility to combine the perfect surface with the good mechanical properties of the crystalline material. Nevertheless, the challenge is the integration of mono-crystalline silicon in a CMOS process with low temperature budget (below 450deg C) and restricted material options. Thus, standard processes like epitaxial growth or re-crystallization of poly-silicon cannot be used. We will present a CMOS-compatible approach, using adhesive wafer transfer bonding with Benzocyclobutene (BCB) of a 300nm thin silicon membrane, located on a SOI donor wafer. After the bond process, the SOI donor wafer is grinded and spin etched to remove the handle silicon and the buried oxide layer, which results in a transfer of the mono-crystalline silicon membrane to the CMOS wafer. This technology is fully compatible for integration in a CMOS process, in order to fabricate SLMs, consisting of one million indivvidually addressable mono-crystalline silicon micro-mirrors. In this paper, we present fabrication process as well as first results of SLM devices with a pixel pitch of 16 micrometer.

Place, publisher, year, edition, pages
2009.
Keyword [en]
CMOS heterogeneous integration 3D MEMS micromirror array mono-crystalline silicon maskless lithography
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-48956OAI: oai:DiVA.org:kth-48956DiVA: diva2:459039
Conference
MikroSystemTechnik KONGRESS 2009. Berlin, Germany. 10/12/2009 - 10/14/2009
Note
QC 20111128Available from: 2011-11-24 Created: 2011-11-24 Last updated: 2011-11-28Bibliographically approved

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Niklaus, Frank

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
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  • de-DE
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  • en-US
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  • sv-SE
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Output format
  • html
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  • asciidoc
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