Change search
ReferencesLink to record
Permanent link

Direct link
Fabrication of mono-crystalline Silicon Micro-mirror Arrays using adhesive Wafer Transfer Bonding
KTH, School of Electrical Engineering (EES), Microsystem Technology.
Show others and affiliations
2009 (English)In: MikroSystemTechnik KONGRESS 2009, 2009Conference paper (Other academic)
Abstract [en]

Spatial light modulators (SLMs) based on indivvidually addressable micro-mirrors do show an increased use in projection displays, DUV lithography and adaptive optics. Mirror planarity and deflection characteristics are important issues for these applications. Mono-crystalline silicon as mirror material offers a great possibility to combine the perfect surface with the good mechanical properties of the crystalline material. Nevertheless, the challenge is the integration of mono-crystalline silicon in a CMOS process with low temperature budget (below 450deg C) and restricted material options. Thus, standard processes like epitaxial growth or re-crystallization of poly-silicon cannot be used. We will present a CMOS-compatible approach, using adhesive wafer transfer bonding with Benzocyclobutene (BCB) of a 300nm thin silicon membrane, located on a SOI donor wafer. After the bond process, the SOI donor wafer is grinded and spin etched to remove the handle silicon and the buried oxide layer, which results in a transfer of the mono-crystalline silicon membrane to the CMOS wafer. This technology is fully compatible for integration in a CMOS process, in order to fabricate SLMs, consisting of one million indivvidually addressable mono-crystalline silicon micro-mirrors. In this paper, we present fabrication process as well as first results of SLM devices with a pixel pitch of 16 micrometer.

Place, publisher, year, edition, pages
Keyword [en]
CMOS heterogeneous integration 3D MEMS micromirror array mono-crystalline silicon maskless lithography
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
URN: urn:nbn:se:kth:diva-48956OAI: diva2:459039
MikroSystemTechnik KONGRESS 2009. Berlin, Germany. 10/12/2009 - 10/14/2009
QC 20111128Available from: 2011-11-24 Created: 2011-11-24 Last updated: 2011-11-28Bibliographically approved

Open Access in DiVA

No full text

Search in DiVA

By author/editor
Lapisa, MartinNiklaus, Frank
By organisation
Microsystem Technology
Other Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

Total: 35 hits
ReferencesLink to record
Permanent link

Direct link