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NOVEL ROOM-TEMPERATURE WAFER-TO-WAFER ATTACHMENT AND SEALING OF CAVITIES USING COLD METAL WELDING
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-9820-8728
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
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2008 (English)In: Proceedings Micro System Workshop MSW08, 2008Conference paper, Published paper (Other academic)
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2008.
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Engineering and Technology
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URN: urn:nbn:se:kth:diva-48963OAI: oai:DiVA.org:kth-48963DiVA: diva2:459075
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QC 20111130Available from: 2011-11-24 Created: 2011-11-24 Last updated: 2011-11-30Bibliographically approved

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Forsberg, FredrikNiklaus, FrankStemme, Göran

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