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Increasing the Performance per Cost of Microsystems by Transfer Bonding Manufacturing Techniques
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-8248-6670
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2008 (English)Other (Other academic)
Place, publisher, year, pages
2008.
Keyword [en]
Q2M, SMA, wafer bonding, microvalves, RF-MEMS, micromirrors, PZT
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Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-48961OAI: oai:DiVA.org:kth-48961DiVA: diva2:459083
Note
QC 20111128Available from: 2011-11-24 Created: 2011-11-24 Last updated: 2011-11-28Bibliographically approved

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Wijngaart, Wouter van derSandström, NiklasNiklaus, Frank

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Wijngaart, Wouter van derBraun, StefanSandström, NiklasNiklaus, FrankLapisa, Martin
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