Method of joining components
2000 (English)Patent (Other (popular science, discussion, etc.))
A method of combining components to form an integrated device, wherein the components are provided on a first sacrificial wafer, and a second non-sacrificial wafer, respectively. The sacrificial wafer carries a first plurality of components and the non-sacrificial wafer carries a second plurality of components. The wafers are bonded together with an intermediate bonding material. Optionally the sacrificial wafer is thinned to a desired level. The components of the sacrificial wafer are electrically interconnected to the component(s) on the non-sacrificial wafer. Finally, optionally the intermediate bonding material is stripped away.
Place, publisher, year, edition, pages
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-51352OAI: oai:DiVA.org:kth-51352DiVA: diva2:463948
US 7067345 (2006-06-27)
EP 1275146-B1 (2013-07-31)2011-12-122011-12-122013-08-07Bibliographically approved