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Fabrication of Through Silicon Vias (TSVs) with RF Capability by Magnetic Assembly of Nickel Wires
KTH, School of Electrical Engineering (EES), Microsystem Technology.
2011 (English)Student paper other, 20 credits / 30 HE creditsStudent thesis
Abstract [en]

Within this master thesis work, a novel TSV technology with RF capabilities is presented. A major focus was laid on the design and the construction of a fully automated fabrication tool for the assembly of Ni TSV cores. The utilisation of the ferromagnetic properties of nickel allowed for a highly parallelised self-assembly process which was implemented in the automated fabrication. Furthermore, a special eort was made to improve the RF capabilities of this type of TSVs. In order to increase the RF conductibility, a novel type of metal conductor was devised and fabricated. The deposition of a thin gold layer on the perimeter of the conductor allowed for an optimal utilisation of the skin eect to enhance the RF performance. The above-mentioned newly developed assembly tool was then used to build RF transmission lines test structures.

Place, publisher, year, edition, pages
2011. , 54 p.
Series
EES Examensarbete / Master Thesis, XR-EE-MST 2011:007
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-55475OAI: oai:DiVA.org:kth-55475DiVA: diva2:471683
Uppsok
Technology
Examiners
Available from: 2012-01-19 Created: 2012-01-02 Last updated: 2012-03-15Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
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  • ieee
  • modern-language-association-8th-edition
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More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf