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Adhesive Wafer Bonding for Packaging Applications
KTH, Superseded Departments, Signals, Sensors and Systems.ORCID iD: 0000-0002-0525-8647
KTH, Superseded Departments, Signals, Sensors and Systems.
KTH, Superseded Departments, Signals, Sensors and Systems.ORCID iD: 0000-0001-9552-4234
2003 (English)Conference paper, Published paper (Other academic)
Place, publisher, year, edition, pages
2003.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-59150OAI: oai:DiVA.org:kth-59150DiVA: diva2:475148
Conference
Workshop on MEMS Sensor Packaging 2003; Copenhagen, Denmark, 20-21 March 2003
Note

QC 20131127

Available from: 2012-01-10 Created: 2012-01-10 Last updated: 2013-11-27Bibliographically approved

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Niklaus, FrankStemme, Göran

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