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Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures:  
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.
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2010 (English)In: Proceedings: Micronano System Technology Event MSW 2010, Stockholm: - , 2010, , 86 p.86- p.Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
Stockholm: - , 2010. , 86 p.86- p.
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Natural Sciences
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URN: urn:nbn:se:kth:diva-59164OAI: oai:DiVA.org:kth-59164DiVA: diva2:475236
Conference
8th Micronano System Technology Event (MSW), Stockholm, Sweden 4-5 May 2010
Note
QC 20120112Available from: 2012-01-10 Created: 2012-01-10 Last updated: 2012-01-12Bibliographically approved

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Fischer, Andreas C.Stemme, GöranNiklaus, Frank

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Fischer, Andreas C.Lapisa, MartinRoxhed, NiclasAntelius, MikaelStemme, GöranNiklaus, Frank
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