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Selective Wafer Level Adhesive Bonding with Benzocyclobutene
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
2001 (English)In: Proc. Micromechanics Europe MME 2001, 2001, 54-57 p.Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2001. 54-57 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-61055OAI: oai:DiVA.org:kth-61055DiVA: diva2:478431
Conference
Micromechanics Europe MME 2001, Cork, Ireland, Sep. 16-18, 2001
Note
NR 20140805Available from: 2012-01-16 Created: 2012-01-16Bibliographically approved

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Niklaus, FrankStemme, Göran

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