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Material aspects for batch integration of PZT thin films using transfer bonding technologies: Q2M development
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2008 (English)In: Proc. 4M 2008 Conference on Multi-Material Micro Manufacture, 2008Conference paper (Other academic)
Abstract [en]

Transfer bonding is a reliable cost-efficient and low-temperature CMOS compatible technique which allows batchintegration of materials whose incompatibility with Si makes them unsuitable for monolithic integration. In thisheterogeneous device integration method the material and process incompatibilities inherent in Si IC technology areovercome by fabricating devices on separate substrates and then transferring them onto target (e.g. CMOS) wafers.Transfer bonding has great potential for integrating RF-MEMS devices incorporating, for example, high thermal budgetmaterials such as PZT and PST or non-ferroelectric piezoelectrics such as AlN and ZnO into microwave ICs forenhanced systems performance. This paper presents an overview of technology developments within the EUsponsored project Q2M for the realization of transfer bonded piezoelectrically actuated RF MEMS switches and othercomponents focusing in particular on material factors relating to growth of the piezoelectric films, in this case sol-geldeposited PZT, that restricts the choice of device layers and impact on PZT properties such as microstructure, filmorientation and piezoelectric coefficients. New process developments such as hard masking of PZT pattern during RIEetching and its compatibility with polymer transfer bonding are discussed.

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Keyword [en]
PZT, transfer bonding, RF MEMS switches, sol-gel
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
URN: urn:nbn:se:kth:diva-61491OAI: diva2:479238
4M2008 Conference on Multi-Material Micro Manufacture. Cardiff, UK. Sept. 9-11, 2008
QC 20120514Available from: 2012-01-17 Created: 2012-01-17 Last updated: 2012-05-14Bibliographically approved

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Saharil, FarizahOberhammer, Joachim
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Microsystem Technology
Electrical Engineering, Electronic Engineering, Information Engineering

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