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Mobile wireless sensor system for tracking and environmental supervision
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
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2010 (English)In: IEEE INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS (ISIE 2010), IEEE conference proceedings, 2010, 470-477 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper a system level analysis andimplementation of two-layer mobile wireless sensor networkarchitecture is proposed for tracking and environmentalsupervision applications. It uses a mobile Master Sensor Node(MSN) that collects information inside a Sensor Area Network(SAN) where many semi-passive Slave Sensor Nodes (SSN) aredeployed. The collected information is sent through a WirelessWide Area Network (WWAN) infrastructure to a central server viaTCP/UDP. The communication interface between the user and theMSN is established through out mobile communication services orinternet mail services. The communication between the MSN andthe SSN is through asymmetric-link Radio FrequencyIdentification (RFID) based architecture. An MSN prototype hasbeen implemented and tested under real conditions forenvironmental supervision during the perishable goodstransportation.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2010. 470-477 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-62209DOI: 10.1109/ISIE.2010.5637855ISI: 000295007800074Scopus ID: 2-s2.0-78650375226OAI: oai:DiVA.org:kth-62209DiVA: diva2:479961
Conference
IEEE International Symposium on Industrial Electronics (ISIE 2010). Bari, ITALY. JUL 04-07, 2010
Note

QC 20120119

Available from: 2012-01-18 Created: 2012-01-18 Last updated: 2014-09-24Bibliographically approved

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Sarmiento M., DavidPang, ZhiboChen, QiangTenhunen, H.Zheng, Lirong
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VinnExcellence Center for Intelligence in Paper and Packaging, iPACKElectronic Systems
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