Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
CMIT: A novel cluster-based topology for 3D stacked architectures
Show others and affiliations
2010 (English)In: IEEE 3D System Integration Conference 2010, 3DIC 2010, 2010Conference paper, Published paper (Refereed)
Abstract [en]

Combining the benefits of 3D IC and Network-on-Chip (NoC) schemes, provides a significant performance gain for 3D stacked architectures. In recent years, Through-Silicon-Via (TSV), employed for inter-layer connectivity (vertical channel), has attracted a lot of interest since it enables faster and more power efficient inter-layer communication across multiple stacked layers. However, the area overhead of TSVs reduces wafer utilization and yield which impact design of 3D architectures using a large number of TSVs. In this paper, we propose a novel stacked topology, named CMIT (Cluster Mesh Inter-layer Topology) for 3D architectures to reduce the area overhead of TSVs and power dissipation on each layer with minimal performance penalty. Experimental results with synthetic test cases demonstrate that the presented topology can save more than 75% of TSV area footprint and reduces more than 10% of power consumption with a negligible performance overhead.

Place, publisher, year, edition, pages
2010.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-73463DOI: 10.1109/3DIC.2010.5751452Scopus ID: 2-s2.0-79955962345ISBN: 978-145770527-4 (print)OAI: oai:DiVA.org:kth-73463DiVA: diva2:488965
Conference
2nd IEEE International 3D System Integration Conference, 3DIC 2010. Munich, Germany 16 November 2010 - 18 November 2010
Note

QC 20150708

Available from: 2012-02-02 Created: 2012-02-02 Last updated: 2015-07-08Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full textScopus

Search in DiVA

By author/editor
Tenhunen, Hannu
By organisation
Electronic Systems
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 65 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf