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Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs)
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
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2009 (English)Conference proceedings (editor) (Refereed)
Place, publisher, year, edition, pages
IEEE conference proceedings, 2009.
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Engineering and Technology
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URN: urn:nbn:se:kth:diva-72989OAI: oai:DiVA.org:kth-72989DiVA: diva2:489035
Note
QC 20120203Available from: 2012-02-02 Created: 2012-02-01 Last updated: 2012-02-03Bibliographically approved

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Weerasekera, RoshanPamunuwa, DineshTenhunen, HannuZheng, Lirong
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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
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Language
  • de-DE
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  • en-US
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