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RF Transceiver Circuit Technology Based Wireless Interconnects for Inter- and Intra-Chip Communication System
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
2008 (English)In: EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, 1409-1414 p.Conference paper (Refereed)
Abstract [en]

In this work, some most frequently studied interconnect solutions in recent years have been discussed and compared to show their advantages and limitations. RF wireless interconnect (RFWI) method is further studied by system modeling in simulink environment and successful communication between transmitter and receiver is obtained. The results indicate the potential feasibility and reliability of the inter-chip and intra-chip communication system using integrated RF transceiver and antenna to replace the present metal wiring interconnect. The fact that lots of the existing experiences on RF transceiver and antenna design makes RFWI an attractive interconnect solution.

Place, publisher, year, edition, pages
2008. 1409-1414 p.
, Electronics Packaging Technology Conference Proceedings
Keyword [en]
RF transceiver circuit;RF wireless interconnect;antenna;inter-chip communication system;intra-chip communication system;metal wiring interconnect;receiver;simulink environment;system modeling;transmitter;antennas;integrated circuit interconnections;radiofrequency integrated circuits;transceivers;
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
URN: urn:nbn:se:kth:diva-73979DOI: 10.1109/EPTC.2008.4763628ISI: 000265818600225OAI: diva2:489122
10th Electronics Packing Technology Conference. Singapore, SINGAPORE. DEC 09-12, 2008

QC 20120203

Available from: 2012-02-02 Created: 2012-02-02 Last updated: 2016-05-11Bibliographically approved

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ReferencesLink to record
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