RF Transceiver Circuit Technology Based Wireless Interconnects for Inter- and Intra-Chip Communication System
2008 (English)In: EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, 1409-1414 p.Conference paper (Refereed)
In this work, some most frequently studied interconnect solutions in recent years have been discussed and compared to show their advantages and limitations. RF wireless interconnect (RFWI) method is further studied by system modeling in simulink environment and successful communication between transmitter and receiver is obtained. The results indicate the potential feasibility and reliability of the inter-chip and intra-chip communication system using integrated RF transceiver and antenna to replace the present metal wiring interconnect. The fact that lots of the existing experiences on RF transceiver and antenna design makes RFWI an attractive interconnect solution.
Place, publisher, year, edition, pages
2008. 1409-1414 p.
, Electronics Packaging Technology Conference Proceedings
RF transceiver circuit;RF wireless interconnect;antenna;inter-chip communication system;intra-chip communication system;metal wiring interconnect;receiver;simulink environment;system modeling;transmitter;antennas;integrated circuit interconnections;radiofrequency integrated circuits;transceivers;
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-73979DOI: 10.1109/EPTC.2008.4763628ISI: 000265818600225OAI: oai:DiVA.org:kth-73979DiVA: diva2:489122
10th Electronics Packing Technology Conference. Singapore, SINGAPORE. DEC 09-12, 2008
QC 201202032012-02-022012-02-022016-05-11Bibliographically approved