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Optimal number and placement of Through Silicon Vias in 3D Network-on-Chip
KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
2011 (English)In: 14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2011, 2011, 105-110 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, we analyze the performance impact of different number of Through Silicon Vias (TSVs) in 3D Network-on-Chip (NoC). The adoption of a 3D NoC design depends on the performance and manufacturing cost of the chip. Therefore, a study of the placement of the TSV, that connects different layers of a 3D chip, is crucial. A 64-core 3D NoC is modeled based on state-of-the-art 2D chips. We discuss the number of TSVs required for a 3D NoC. Different placements of layer-layer connections are explored. We present benchmark results using a cycle accurate full system simulator based on realistic workloads. Experiments show that under different workloads, the average network latencies in two configurations (full and quarter connection) are reduced by 14.78% and 7.38% respectively, compared with the one-eighth connection design. The improvement of performance is a trade-off of manufacturing cost. Our analysis and experiment results provide a guideline for selecting optimal number of TSVs in 3D NoCs.

Place, publisher, year, edition, pages
2011. 105-110 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-74108DOI: 10.1109/DDECS.2011.5783057Scopus ID: 2-s2.0-79959953294OAI: oai:DiVA.org:kth-74108DiVA: diva2:489243
Conference
14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2011. Cottbus. 13 April 2011 - 15 April 2011
Note

QC 20120207

Available from: 2012-02-02 Created: 2012-02-02 Last updated: 2016-04-11Bibliographically approved

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CiteExportLink to record
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Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf