System integration of smart packages using printed electronics
2012 (English)In: Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, IEEE , 2012, 997-1002 p.Conference paper (Refereed)
The last decade has shown enormous interest in additive and printed electronics manufacturing technologies, especially in intelligent packaging. Scientists and engineers all over the world are developing printed organic circuits. Despite their effort, the performance and yield of all-printed devices cannot replace silicon-based devices in smart package applications. Therefore, we have developed a hybrid interconnection platform to seamlessly integrate printed electronics with silicon-based electronics, close the gap between the two technologies, and to anticipate adaption of printed electronic technologies. We studied the suitability of a printed interconnection platform by fabricating a printed sensor-box that contains printed nano-Ag-interconnections on low-temperature plastic, a printable humidity sensor based on functionalized MWCNTs, a printed battery, conventional SMDs, and a silicon-based MCU.
Place, publisher, year, edition, pages
IEEE , 2012. 997-1002 p.
, Electronic Components & Technology Conference. Proceedings, ISSN 0569-5503
All-printed, Functionalized, Intelligent packaging, Low temperatures, Organic circuits, Printed electronics, Scientists and engineers, Silicon-based, Silicon-based devices, Silicon-based electronics, System integration
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-74096DOI: 10.1109/ECTC.2012.6248957ScopusID: 2-s2.0-84866876788ISBN: 978-146731966-9OAI: oai:DiVA.org:kth-74096DiVA: diva2:489249
2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012; San Diego, CA;29 May 2012 through 1 June 2012
FunderICT - The Next Generation
QC 201211212012-02-022012-02-022013-04-15Bibliographically approved