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Case study of cost and performance trade-off analysis for mixed-signal integration in system-on-chip
KTH, Superseded Departments, Electronic Systems Design.
KTH, Superseded Departments, Electronic Systems Design.
2003 (English)In:  , 2003, Vol. 5Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2003. Vol. 5
Keyword [en]
SPICE simulation; a priori estimation; analog/RF circuitry; cost performance trade-off analysis; early conceptual-level design phases; integration scale; mixed signal isolation; mixed-signal integration; mixed-signal performance requirements; noise coupling model; submicron CMOS technology; system-on-chip; technology fusion; wireless system integration; CMOS integrated circuits; SPICE; circuit simulation; integrated circuit economics; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; system-on-chip;
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-74191DOI: 10.1109/ISCAS.2003.1206380OAI: oai:DiVA.org:kth-74191DiVA: diva2:489281
Conference
Circuits and Systems, 2003. ISCAS ’03. Proceedings of the 2003 International Symposium on
Note
NR 20140805Available from: 2012-02-02 Created: 2012-02-02 Last updated: 2012-02-12Bibliographically approved

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CiteExportLink to record
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  • apa
  • harvard1
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