From 2D to 3D NoCs: A Case Study of the worst-case Communication Performance
2009 (English)In: IEEE/ACM 2009 International Conference on Computer-Aided Design (ICCAD’09), IEEE Computer Society, 2009, 555-562 p.Conference paper (Refereed)
Advanced integration technologies enable the construction of Network-on-Chip (NoC) from two dimensions to three dimensions. Studies have shown that 3D NoCs can improve average communication performance because of the possibility of using the additional dimension to shorten communication distance. In this paper, we present a detailed case study on worst-case communication performance in regular k-ary-2-mesh networks. Through both analysis and simulation, we show that, while 3D networks achieve better average performance, this may not be the case for worst-case performance mainly due to constraints on vertical channels. Our analysis is based on network calculus, which allows to calculate theoretical delay bounds for constrained flows traversing network elements.
Place, publisher, year, edition, pages
IEEE Computer Society, 2009. 555-562 p.
, ICCAD - IEEE / ACM International Conference on Computer-Aided Design. Proceedings, ISSN 1092-3152
2D/3D Network-on-Chip, Delay bound, Network calculus, Performance analysis, Quality-of-service
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-74568ScopusID: 2-s2.0-76349086429ISBN: 978-160558800-1OAI: oai:DiVA.org:kth-74568DiVA: diva2:489885
2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009. San Jose, CA. 2 November 2009 - 5 November 2009
QC 201202062012-02-032012-02-032014-10-09Bibliographically approved