Exploring a low-cost inter-layer communication scheme for 3D networks-on-chip
2010 (English)In: 15th Computer Society of Iran (CSI) Symposium on Computer Architecture and Digital Systems, CADS 2010, 2010, 163-166 p.Conference paper (Refereed)
In this paper, a low-cost 3D NoC architecture based on Bidirectional Bisynchronous Vertical Channels (BBVC) is proposed as a solution to mitigate high area footprints of vertical interconnects. Dynamically self-configurable BBVCs, which can transmit flits in either direction, enable a system to benefit from a high-speed bidirectional channel instead of a pair of unidirectional channels for inter-layer communication. In this architecture, low-latency attribute of the interconnect TSVs enables the system to support a higher frequency for vertical channels, better bandwidth utilization, lower area footprint, and improved routability. In addition, an enhanced BBVC-based communication scheme, called Direct Vertical Channel Access, is presented to enable an express inter-layer communication. Experimental results verify that the proposed architecture can reduce up to 47% TSV area footprint with a negligible performance degradation.
Place, publisher, year, edition, pages
2010. 163-166 p.
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-74765DOI: 10.1109/CADS.2010.5623588ScopusID: 2-s2.0-78650109093ISBN: 978-142446269-8OAI: oai:DiVA.org:kth-74765DiVA: diva2:489957
15th Computer Society of Iran (CSI) Symposium on Computer Architecture and Digital Systems, CADS 2010. Tehran. 23 September 2010 - 24 September 2010
QC 201202062012-02-032012-02-032015-07-29Bibliographically approved