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A 1.0 V 78 uW reconfigurable ASIC embedded in an intelligent electrode for continuous remote ECG applications
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
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2009 (English)In: EMBC: 2009 ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOLS 1-20, 2009, 2316-2319 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, a reconfigurable, low-power Application Specific Integrated Circuit (ASIC) that extracts and transmits electrocardiograph (ECG) signals is presented. An intelligent electrode is introduced which consists of the proposed ASIC and a micro spike array, permitting onsite ECG signal acquisition, processing and transmission. Fabricated in a standard 0.18 mum CMOS process, the ASIC consumes 78 muW with 1.0 V core voltage at 6 MHz operating frequency and only occupies 2.25 mm2. The tiny silicon size makes it possible and suitable to embed the proposed ASIC into an intelligent electrode, and the low power consumption makes it feasible for long term continuous ECG monitoring.

Place, publisher, year, edition, pages
2009. 2316-2319 p.
Series
IEEE Engineering in Medicine and Biology Society Conference Proceedings, ISSN 1557-170X
Keyword [en]
CMOS process;continuous remote ECG monitoring;electrocardiograph signal;frequency 6 MHz;health care;intelligent electrode;low-power application specific integrated circuit;micro spike array;power 78 muW;reconfigurable ASIC;signal acquisition;signal processing;signal transmission;size 0.18 mum;voltage 1.0 V;CMOS integrated circuits;application specific integrated circuits;biomedical electrodes;biomedical electronics;electrocardiography;health care;medical signal processing;patient monitoring;reconfigurable architectures;silicon;
National Category
Medical and Health Sciences
Identifiers
URN: urn:nbn:se:kth:diva-75208DOI: 10.1109/IEMBS.2009.5335120ISI: 000280543601313Scopus ID: 2-s2.0-77950995276OAI: oai:DiVA.org:kth-75208DiVA: diva2:490332
Conference
Annual International Conference of the IEEE-Engineering-in-Medicine-and-Biology-Society. Minneapolis, MN. SEP 03-06, 2009
Note
QC 20120416Available from: 2012-02-05 Created: 2012-02-05 Last updated: 2013-03-18Bibliographically approved
In thesis
1. Hybrid Integration of Active Bio-signal Cable with Intelligent Electrode: Steps toward Wearable Pervasive-Healthcare Applications
Open this publication in new window or tab >>Hybrid Integration of Active Bio-signal Cable with Intelligent Electrode: Steps toward Wearable Pervasive-Healthcare Applications
2012 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Personalized and pervasive healthcare help seamlessly integrate healthcare and wellness into people’s daily life, independent of time and space. With the developments in biomedical sensing technologies nowadays, silicon based integrated circuits have shown great advantages in terms of tiny physical size, and low power consumption. As a result, they have been found in many advanced medical applications. In the meanwhile, printed electronics is considered as a promising approach enabling cost-effective manufacturing of thin, flexible, and light-weight devices. A hybrid integration of integrated circuits and printed electronics provides a promising solution for the future wearable healthcare devices.

This thesis first reviews the current approaches for bio-electric signal sensing and the state-of-the-art designs for biomedical circuit and systems. In the second part, the idea of Intelligent Electrode and Active Cable for wearable ECG monitoring systems is proposed. Based on this concept, we design and fabricate two customized IC chips to provide a single cable solution for long-term healthcare monitoring. The first chip is a digital ASIC with a serial communication protocol implemented on chip to support data and command packets transmission between different ASIC chips. Also, it has on-chip memory to buffer the digital bio-signal. An Intelligent Electrode is formed by embedding the ASIC chip into the conductive electrode. With the on-chip integrated communication protocol, a wired sensor network can be established enabling the single cable solution. The ASIC’s controlling logic is capable of making dynamic network management, thus endows the electrode with local intelligence. The second chip is a fully integrated mixed-signal SoC. In addition to the digital controller implemented and verified in the first chip, another 2 key modules are integrated: a tunable analog front end circuits, and a 6-input SAR ADC. The second chip works as a networked SoC sensor. The command-based network management is verified through functional tests using the fabricated SoCs. With the programmable analog front end circuits, the SoC sensor can be configured to detect a variety of bio-electric signals. EOG, EMG, ECG, and EEG signals are successfully recorded through in-vivo tests.

This research also explores the potential of using high accurate inkjet printing technology as an inexpensive integration method and enabling technology to design and fabricate bio-sensing devices. Performance evaluation of printed electrodes and interconnections on flexible substrates is made to examine the feasibility of applying them in the fabrication of Bio-Patch. The reliability of the inkjet printed sliver traces is evaluated via static bending tests. The measurement results prove that the printed silver lines can offer a reliable interconnection. In-vivo test results show that the quality of ECG signal sensed by the printed electrodes is comparable with the one gained by commercial electrodes.

Finally, two Bio-Patch prototypes are presented: one is based on photo paper substrate, the other on polyimide substrate. These two prototypes are implemented by heterogeneous integration of the silicon based SoC sensor with cost-effective printed electronics onto the flexible substrates. The measurement results indicate the SoC operates smoothly with the printed electronics. Clean ECG signal is successfully recorded from both of the implemented Bio-Patch prototypes. This versatile SoC sensor can be used in various applications according to specific requirements. And this heterogeneous system combining high-level integrated SoC technology and inkjet printing technique provides a promising solution for future personalized and pervasive healthcare applications.

Place, publisher, year, edition, pages
Stockholm: KTH Royal Institute of Technology, 2012. xiii, 60 p.
Series
Trita-ICT-ECS AVH, ISSN 1653-6363
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
SRA - ICT
Identifiers
urn:nbn:se:kth:diva-119280 (URN)978-91-7501-670-2 (ISBN)
Public defence
2013-04-16, Sal-E, Forum 120, Isafjordsgatan 39, Kista, 13:00 (English)
Opponent
Supervisors
Note

QC 20130318

Available from: 2013-04-19 Created: 2013-03-11 Last updated: 2013-04-19Bibliographically approved

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Yang, GengChen, JianJonsson, FredrikTenhunen, HannuZheng, Li-Rong
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