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Creating Microstructures on Silicon Wafers Using UV-Crosslinked Polystyrene Thin Films
Portland State Univ, Dept Chem, Portland, OR 97207 USA .
KTH, School of Chemical Science and Engineering (CHE), Chemistry.
2009 (English)In: Polymer Engineering and Science, ISSN 0032-3888, E-ISSN 1548-2634, Vol. 49, 945-948 p.Article in journal (Refereed) Published
Abstract [en]

We report that UV-crosslinked polystyrene (PS) thin films can be used as an inexpensive wet chemical etch resist to create microstructures on silicon wafers. When spin-coated PS films were irradiated, the polymer undergoes UV-induced crosslinking. Patterned PS films were successfully used as the protective layer withstanding chemical etching with the buffered HF solution. Removal of the polymer films by sonicating in water generated microstructures in silicon wafers. This simple and environmentally friendly procedure employs inexpensive commodity polymer and eliminates the use of organic solvents and harsh conditions in the subsequent development process. POLYM. ENG. SCI., 49:945-948, 2009. (C) 2009 Society of Plastics Engineers

Place, publisher, year, edition, pages
2009. Vol. 49, 945-948 p.
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Chemical Sciences
URN: urn:nbn:se:kth:diva-77359DOI: 10.1002/pen.21272ISI: 000265449000017OAI: diva2:492017
16th Annual Polychar World Forum on Advanced Materials, Lucknow, INDIA, FEB 17-21, 2008. QC 20120210Available from: 2012-02-07 Created: 2012-02-06 Last updated: 2012-02-10Bibliographically approved

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