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Method for sealing a microcavity and package comprising at least one microcavity
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-9552-4234
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
2002 (English)Patent (Other (popular science, discussion, etc.))
Abstract [en]

A hermetically sealed package comprises a first wafer and a second wafer joined together by a bonding formed by a patterned intermediate bonding material. The bonding material is an adhesive bonding material and in that the package comprises at least one diffusion barrier formed in a different material from the bonding material.A number of packages can be made simultaneously by a method comprising the step of providing a patterned intermediate bonding material on at least one of said first and second wafer aligning said first and second wafer and applying pressure to join the first wafer and the second wafer together by means of the patterned intermediate bonding material further comprising the step of providing a material suitable for forming a diffusion barrier on at least one of said first and second wafer, in addition to the bonding material.

Place, publisher, year, edition, pages
2002.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-77842OAI: oai:DiVA.org:kth-77842DiVA: diva2:492147
Patent
EP 1540727 (2010-10-20)
Note

QC 20120208. QC 20130806

Available from: 2012-02-08 Created: 2012-02-07 Last updated: 2013-08-06Bibliographically approved

Open Access in DiVA

fulltext(819 kB)88 downloads
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Type fulltextMimetype application/pdf

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Niklaus, FrankStemme, Göran

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CiteExportLink to record
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  • apa
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