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Adhesive Wafer Bonding and Applications
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
2009 (English)In: Proceedings of Waferbond'09, 2009, 53-56 p.Conference paper, Published paper (Refereed)
Abstract [en]

Wafer bonding with intermediate polymer adhesives is an important fabrication technique that is beingused in manufacturing of various microelectronic, MEMS, photonic and microfluidic systems.Applications include heterogeneous integration, wafer-level packaging, three dimensional integratedcircuits (3D-ICs) and temporary handle wafer technologies. In adhesive wafer bonding, the polymeradhesive bears the forces involved to hold the surfaces together. The main advantages of adhesivewafer bonding include the insensitivity to surface topography, the low bonding temperatures, thecompatibility with standard integrated circuit wafer processing and the ability to join different types ofwafers. Compared to alternative wafer bonding techniques, adhesive wafer bonding is simple, robustand low cost. This paper reviews polymer adhesive wafer bonding technologies, its materials and itsapplications.

Place, publisher, year, edition, pages
2009. 53-56 p.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-79008OAI: oai:DiVA.org:kth-79008DiVA: diva2:494630
Conference
Waferbond'09. Grenoble. December 7-8, 2009
Note
QC 20120502Available from: 2012-02-08 Created: 2012-02-08 Last updated: 2012-05-02Bibliographically approved

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Niklaus, Frank

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