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On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits
Centre for Microsystems Engineering, Faculty of Science and Technology, Lancaster University.
Centre for Microsystems Engineering, Faculty of Science and Technology, Lancaster University.
Centre for Microsystems Engineering, Faculty of Science and Technology, Lancaster University.
KTH, School of Information and Communication Technology (ICT), Electronic Systems.
2010 (English)In: Design, Automation and Test in Europe Conference and Exhibition, DATE 2010, 2010, 1325-1328 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper discusses signal integrity (SI) issues and signalling techniques for Through Silicon Via (TSV) interconnects in 3-D Integrated Circuits (ICs). Field-solver extracted parasitics of TSVs have been employed in Spice simulations to investigate the effect of each parasitic component on performance metrics such as delay and crosstalk and identify a reduced-order electrical model that captures all relevant effects. We show that in dense TSV structures voltage-mode (VM) signalling does not lend itself to achieving high data-rates, and that current-mode (CM) signalling is more effective for high throughput signalling as well as jitter reduction. Data rates, energy consumption and coupled noise for the different signalling modes are extracted.

Place, publisher, year, edition, pages
2010. 1325-1328 p.
Keyword [en]
3D integrated circuits;Spice simulations;current-mode signalling;jitter reduction;reduced-order electrical model;signal integrity;through-silicon via interconnects;voltage-mode signalling;SPICE;crosstalk;integrated circuit interconnections;
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-79285Scopus ID: 2-s2.0-77953116301ISBN: 978-1-4244-7054-9 (print)OAI: oai:DiVA.org:kth-79285DiVA: diva2:495291
Conference
Design, Automation and Test in Europe Conference and Exhibition, DATE 2010. Dresden. 8 March 2010 - 12 March 2010
Note
QC 20120209Available from: 2012-02-08 Created: 2012-02-08 Last updated: 2012-02-12Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
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Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
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  • Other locale
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Output format
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  • asciidoc
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