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Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
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2004 (English)In: 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, Vol. 2, 1687-1692 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, we present a chip-package co-design of a concurrent low noise amplifier (LNA) in novel liquid crystal polymer (LCP) based system-on-package module for multiband radio transceivers. The module consists of a wideband LNA covering frequency range 1 GHz - 13 GHz and a multiband pass filter. By designing an appropriate multi-band passive filter, the wideband LNA can be configurated flexibly as a multi-band LNA that works currently across any different band in the above frequency range. In this work the multiband LNA is designed for 5 GHz wireless LAN and 2.5 GHz Bluetooth standards. The module is implemented with embedded chip technologies for system-on-package, which eliminates the constraints of off-chip pad drive capability and hence improves electrical performance. The design is implemented on novel liquid crystal polymer (LCP) substrate. The quality factors of key passive components such as inductors integrated on LCP substrate with thin film technologies is better than 30. The insertion loss of the band pass filter is around 3 dB and return loss is lower than -18 dB. The gain of the wideband LNA is better than 10 dB at frequency range from I GHz to 13 GHz. and its gain is better than 10 dB. The gain of the multi-band LNA is 8.5 dB and noise figure is 5.2 dB on the selected channels.

Place, publisher, year, edition, pages
2004. Vol. 2, 1687-1692 p.
Series
ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ISSN 0569-5503 ; 2
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-80351Scopus ID: 2-s2.0-10444241854OAI: oai:DiVA.org:kth-80351DiVA: diva2:496254
Conference
54th Electronic Components and Technology Conference. Las Vegas, NV. FEB 03, 2004
Note

QC 20120229

Available from: 2012-02-09 Created: 2012-02-09 Last updated: 2016-12-16Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
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  • de-DE
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Output format
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