Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such
2006 (English)Patent (Other (popular science, discussion, etc.))
The device according to the invention comprises an integrated device (10) with a pressure sensor (11) having a membrane (20) comprising a high performance material over a cavity (34). The pressure sensor (11) is integrated on a semiconductor substrate (14) that comprises an integrated circuit (15) so that the membrane (20) with the cavity (34) underneath is located at least partly over the integrated circuit (15). The present invention also provides a method for manufacturing an integrated device (10).
Place, publisher, year, edition, pages
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-80737OAI: oai:DiVA.org:kth-80737DiVA: diva2:496690
QS 20152012-02-102012-02-102015-01-20Bibliographically approved