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Combining components to form integrated device, especially micro mirror spatial light modulator, comprises an adhesive sacrificial bonding technique
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-9552-4234
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0525-8647
2001 (English)Patent (Other (popular science, discussion, etc.))
Place, publisher, year, edition, pages
2001.
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Engineering and Technology
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URN: urn:nbn:se:kth:diva-80833OAI: oai:DiVA.org:kth-80833DiVA: diva2:496783
Patent
SE 523596 (2004-05-04)
Note

QC 20120210. QC 20130807

Available from: 2012-02-10 Created: 2012-02-10 Last updated: 2013-08-07Bibliographically approved

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Stemme, GöranNiklaus, Frank

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