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Thermosyphon concept for cooling of PCB
KTH, School of Industrial Engineering and Management (ITM), Energy Technology, Applied Thermodynamics and Refrigeration.
2002 (English)Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2002.
National Category
Energy Engineering
Identifiers
URN: urn:nbn:se:kth:diva-84751OAI: oai:DiVA.org:kth-84751DiVA: diva2:499581
Conference
8th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC, Oct 2002, Madrid, Spain
Note
NR 20140805Available from: 2012-02-13 Created: 2012-02-13Bibliographically approved

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CiteExportLink to record
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Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
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  • Other locale
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Output format
  • html
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