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Effect of annealing temperature on the barrier height of nano-particle embedded Ni-contacts to 4H-SiC
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0002-8760-1137
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0001-8108-2631
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2011 (English)In: 2011 International Semiconductor Device Research Symposium (ISDRS), 2011, 1-2 p.Conference paper, Published paper (Refereed)
Abstract [en]

In order to realize stable SiC (Silicon carbide) devices, metal contacts to SiC with suitable physical and electrical characteristics are required. For example, Ohmic contacts with low specific contact resistances and Schottky contacts with controlled barrier height ( #x03A6;B) between SiC and metal are among the most important factors for determining the performance of SiC devices. To date, extensive studies have been carried out on the properties of barrier height of various metals on n- and p-type for SiC and many attempts have been made to modify the contact barrier height on SiC depending on the annealing temperature. To change effectively lower the barrier height of the metal/SiC structures, it was required to anneal the contact formed on highly doped 4H-SiC substrates ( #x003E;1018 cm #x2212;3) at high temperatures (900 #x223C;1000 #x00B0;C) [1]. Recently, the electrical contacts to SiC includes the implementation of nanostructures such as metal nano-partices (NPs) to modify the barrier height at metal-SiC interfaces and to alter fundamental SiC device properties by controlling the size of the metal NPs [2]. Previous results in the literature have been primarily focused on the effect of size reduction of NPs on the characteristics of diode structures with embedded NPs, which experimentally investigates the change in transport properties of metal/semiconductor interfaces in SiC depending on the size of NPs. However, so far the focus has been mainly on the scaling effect of NPs rather than on altering the electrical barrier of the NPs [3].

Place, publisher, year, edition, pages
2011. 1-2 p.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-84953DOI: 10.1109/ISDRS.2011.6135231Scopus ID: 2-s2.0-84863177600OAI: oai:DiVA.org:kth-84953DiVA: diva2:499731
Conference
ISDRS 2011. College Park, MD. 7-9 Dec. 2011
Note
QC 20120411Available from: 2012-02-13 Created: 2012-02-13 Last updated: 2012-04-11Bibliographically approved

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Hallen, AndersZetterling, Carl-Mikael

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