Metrology of micro-components – a real challenge for the future
2006 (English)In: Proceedings of the 5th International Seminar on Intelligent Computation in Manufacturing Engineering (CIRP ISME ’06) / [ed] R. Teti, CIRP , 2006, 547-552 p.Conference paper (Refereed)
Micro manufacturing is steadily advancing from research labs to spin off companies. Products formerly manufactured by thin film technology using semiconductor processes are being replaced by more efficient full 3D micro manufacturing techniques. Materials have expanded to polymers, metals and ceramics. From being wafer based structures of tens of microns in width and a thickness of up to a micron, feature sizes are now a few microns wide and hundreds of microns deep. This puts very high demands on the geometrical dimensional and roughness measurement tools of the future. This paper gives a review of current metrology tools available for dimensional and surface characterization, and their limitations. It will also present the requirements of future instruments and discuss potential techniques to solve these issues.
Place, publisher, year, edition, pages
CIRP , 2006. 547-552 p.
Micro metrology, high aspect ratio, CMM, optical probe, surface roughness, micro manufacture
Production Engineering, Human Work Science and Ergonomics Nano Technology
Research subject SRA - Production
IdentifiersURN: urn:nbn:se:kth:diva-85470OAI: oai:DiVA.org:kth-85470DiVA: diva2:500049
CIRP ISME ’06, 25 – 28 July 2006, Ischia, Italy
Projects4M Multi Material Micro Manufacture Network of Excellence
FunderXPRES - Initiative for excellence in production research
QC 201202172012-02-172012-02-132012-02-17Bibliographically approved