Complementing or replacing silicon and III–Vs: The role of plasmonics and novel materials in future integrated photonics for telecom and interconnects
2011 (English)In: 2011 13th International Conference on Transparent Optical Networks, ICTON 2011, IEEE Communications Society, 2011Conference paper (Refereed)
Integrated photonics has largely been based on silicon/silica and III-Vs in recent times. Both have their advantages and disadvantages, but neither seem capable of supporting a further significant reduction of device footprint to sustain the exponential decrease of this important parameter that we have witnessed since decades. The talk will analyze different aspects of plasmonics from this and a functionality point of view and further discuss some possible alternative materials.
Place, publisher, year, edition, pages
IEEE Communications Society, 2011.
, International Conference on Transparent Optical Networks, ISSN 21627339
Plasmonics, integrated photonics, nanophotonics
Research subject SRA - ICT
IdentifiersURN: urn:nbn:se:kth:diva-86398DOI: 10.1109/ICTON.2011.5970804ScopusID: 2-s2.0-80155140401ISBN: 978-1-4577-0881-7ISBN: 978-1-4577-0880-0OAI: oai:DiVA.org:kth-86398DiVA: diva2:500696
2011 13th International Conference on Transparent Optical Networks, ICTON 2011. Stockholm. 26 June 2011 - 30 June 2011
QC 201202162012-02-132012-02-132012-02-16Bibliographically approved