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Intelligent paper and packaging - Integration of microelectronics technologies into paper and packaging products
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
2007 (English)In: International Paperworld IPW, ISSN 1615-1720, no 11, 56-58 p.Article in journal (Other academic) Published
Abstract [en]

The integration of microelectronics technologies and intelligent packaging into the paper and packaging products are creating new business opportunities. Intelligent and interactive packaging aims to make traditional food packaging smart, active and user-friendly. he printed optical code or integrated radio-frequency identification (RFID) chips will allow the customers to link the products directly to mobile Internet through the camera or near field communication. The paper can be used as a paper-based biochip for biochemical analysis by integrating biochemical sensors or a sensor array. VINN Excellence iPack Center has been established with the focus on ubiquitous intelligence in paper and packaging. The center will establish collaborations between the forest products industry, the electronics industry and the biomedical industry in the area of intelligent paper and packaging for biomedical applications.

Place, publisher, year, edition, pages
2007. no 11, 56-58 p.
Keyword [en]
Business opportunities, Intelligent, Intelligent paper and packaging, Near field communication, Radio-frequency identification (RFID) chips
National Category
Communication Systems
Identifiers
URN: urn:nbn:se:kth:diva-87931Scopus ID: 2-s2.0-36548999231OAI: oai:DiVA.org:kth-87931DiVA: diva2:502034
Note

QC 20120217

Available from: 2012-02-14 Created: 2012-02-14 Last updated: 2014-04-08Bibliographically approved

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  • en-US
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  • Other locale
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Output format
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  • asciidoc
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