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20 GHz bandwidth of lasers flip-chip-mounted on microstructured carriers with integrated electrical waveguides
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1998 (English)In: Optical Communication, 1998. 24th European Conference on, 1998, Vol. 1, p. 205-206Conference paper, Published paper (Refereed)
Abstract [en]

A flip-chip-mounting scheme for high-speed lasers has been realised. The mounting scheme involves a microstructured silicon carrier with integrated membrane transmission lines and self-aligning solder bumps

Place, publisher, year, edition, pages
1998. Vol. 1, p. 205-206
Keywords [en]
flip-chip-mounted laser diodes;high-speed lasers;integrated electrical waveguides;integrated membrane transmission lines;microstructured carriers;microstructured silicon carrier;self-aligning solder bumps;flip-chip devices;integrated optics;micromachining;quantum well lasers;transmission lines;
National Category
Telecommunications Atom and Molecular Physics and Optics
Identifiers
URN: urn:nbn:se:kth:diva-89300DOI: 10.1109/ECOC.1998.732504OAI: oai:DiVA.org:kth-89300DiVA, id: diva2:502987
Conference
European Conference on Optical Communication
Note
NR 20140805Available from: 2012-02-14 Created: 2012-02-14 Last updated: 2012-02-14Bibliographically approved

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Schatz, Richard

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